By Bizodisha Bureau, Bhubaneswar, April 19, 2026: Odisha has taken a major step toward becoming a key hub in India’s semiconductor ecosystem with the foundation laying of the country’s first advanced 3D glass substrate packaging facility by 3D Glass Solutions at Infovally here.

Odisha Chief Minister Mohan Charan Majhi on Sunday laid the foundation stone for a major chip packaging facility. The project, being set up by 3D Glass Solutions Inc. (3DGS) at Info Valley, is expected to introduce high-end manufacturing capabilities to the state. The facility, backed by an investment of around Rs 2,000 crore, is expected to manufacture nearly 70,000 glass panels annually, along with 50 million assembled units and 13,200 advanced 3DHI modules. Officials estimate that the project will generate approximately 2,500 direct and indirect employment opportunities.

Majhi claimed that semiconductor-related investments in the state have already crossed Rs 10,000 crore, with companies such as RIR Power Electronics and SiCSem establishing operations in Odisha.

Union Electronics and IT Minister Ashwini Vaishnaw, who attended the ceremony, said, “It is indeed a very important day, a historical day today for Odisha because the semiconductor plant foundation will be done today.” He added that bringing such advanced industrial capacity would mark a shift in the state’s economic profile, noting that “Odisha is now becoming an IT hub. It is becoming an electronics manufacturing hub.”

The facility by 3DGS will focus on advanced chip packaging and embedded glass substrate technology. It aims to deploy innovations such as glass interposers and 3D heterogeneous integration modules— key components for next-generation computing systems. These technologies are expected to support sectors including artificial intelligence, photonics and high-performance computing.

This project is one of two semiconductor-related investments cleared earlier by the Centre for Odisha in 2025. The other, led by SiCSem Private Limited, will manufacture silicon carbide-based devices with applications across defence, electric mobility, rail infrastructure and renewable energy systems. Together, these initiatives are part of a wider national effort to expand domestic semiconductor capabilities. According to official projections, the 3DGS unit will produce tens of thousands of glass panel substrates annually along with millions of assembled units.

The foundation ceremony also coincided with Akshay Tritiya, adding symbolic weight to the launch. Vaishnaw acknowledged both central and state leadership, stating, “I want to thank PM Modi and CM Mohan Charan Majhi. A high-tech industry coming to…” — underscoring the collaborative push behind the initiative. With two out of ten approved semiconductor projects nationwide located in the state, Odisha is positioning itself as a significant node in India’s evolving chip ecosystem.